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Max width Electromagnetic electrodeposited electrolytic ED copper foil 0.1mm for Shielding applications (Standard IPC 4562)
Features | 1.the treated foil in gray or red |
2.High peel strength | |
3.Good etch ability | |
4.Excellent adhesion to etching resist |
1.Phenolic resin board | |
Application: | 2.Epoxy board |
3.shielding application |
Typical properties of Standard copper foil for phenolic resin board and epoxy board.
Classification
| Unit | Requirement | Test Method | |||||||||||
Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ | 1 OZ | 2 OZ | 3 OZ | IPC-4562A | ||||||
Area Weight | g/㎡ | 107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 | IPC-TM-650 2.2.12.2 | ||||||
Purity | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||||||||
Foil Profile | Shiny side (Ra) | սm | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | IPC-TM-650 2.3.17 | |||||
Matte side(Rz) | um | ≤6 | ≤8 | ≤10 | ≤10 | ≤15 | ≤20 | |||||||
Tensile Strength | R.T.(23℃)
| Mpa | ≥150 | ≥220 | ≥235 | ≥280 | ≥280 | ≥280 | IPC-TM-650 2.3.18 | |||||
Elongation | R.T.(23℃)
| % | ≥2 | ≥3 | ≥3 | ≥4 | ≥4 | ≥4 | IPC-TM-650 2.3.18 | |||||
Subject | Ω.g/㎡ | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | ||||||
Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 | IPC-TM-650 2.4.8 | ||||||
Pinholes&porosity | Number | No | IPC-TM-650 2.1.2 | |||||||||||
Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
H.T.(200℃) | Minutes | 60 |
1. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
2. Standard Width,1295(±1)mm,May according to the customer request tailor.
Packing and Mark of ED Shielding copper foil :