JIMA Copper
JIMA COPPER
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1290mm width HTE CU foil copper foil vendor in 35 & 70um for PCB laminate
Detail Specification:
| Single side treatment in red. and single Side Shiny |
| Thickness: 70um & 35um |
| Width range: 5-1380mm,and standard width:1290mm,max 1380mm width |
| high temperature elongation copper foil :120 min (180 °C in Atmosphere) |
| Internal diameter: 76MM |
| Standard :IPC-4562 |
Copper foil Application
| Application | 2>PCB manufacture |
| 3>antenna PCB | |
| 4>PCB laminate 5>Multi-layer printed circuit boards/Multi-layer PCB |
Features and advantages
1.The thermally stable microstructures with their stable mechanical properties
2. Improve dimensional stability
3.Reduce bulging, warping and nail head formation.
These resist thermal outliers which typically occur during laminates.
HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).
| Thickness | um | 18 | 25 | 35 | 70 | IPC 4562 4.6.3.1 | |
| Area weight | g/m² | 153± | 215±5 | 285±5 | 585±8 | IPC 4562 4.6.3.2 | |
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.9 |
| (RZ) | μm | <8.0 | <9.0 | ≤10.0 | <15 | ||
|
Copper≧ | % | 99.8 | IPC 4562 4.6.3.1 | ||||
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >280 | IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >5.0 | >6.0 | >10.0 | >10.0 | IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.35 | >1.70 | >1.8 | >2.0 | IPC 4562 4.6.7 | |
| High temperature oxidation resistance(200℃, 40min) | No color change | Standard | |||||
| Solderability | Good | Standard | |||||
| Solderability | Good | IPC 4562 4.6.12 | |||||
3. Standard Width,1290(±1)mm,May according to the customer request tailor.
Package detail:wooden box