JIMA Copper
JIMA COPPER
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HTE Copper Foil Roll has very good mechanical properties (Elongation ductility), solder and chemical resistance.
Copper foil is the base copper thickness applied on outer and inner layers. The Copper Foil can be pre-attached by the laminate manufacturer to a base material core or it can be introduced in a multi layer board as copper foil before pressing.
HTE Copper Foil Classify:
(STD-E)- standard electrodeposited copper foil.
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.
HTE Copper Foil Detail Specification:
| Single side treatment in red. and single Side Shiny |
| Thickness: 70um,35um |
| Width range: 5-1380mm,standard width:1290mm |
| high temperature elongation copper foil :120 min (180 °C in Atmosphere) |
| Internal diameter: 3 inch/6 inch. |
| Standard :IPC-4562 |
Copper foil Application
| 1>PCB industry . | |
| Application | 2>PCB manufacture |
| 3>antenna PCB,Epoxy board | |
| 4>PCB laminate 5>Multi-layer printed circuit boards. |
Features and advantages
1. The thermally stable microstructures with their stable mechanical properties
2. improve dimensional stability
3. Reduce bulging, warping and nail head formation.
These resist thermal outliers which typically occur during laminates.
HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 | IPC 4562 4.6.3.1 | |
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 | IPC 4562 4.6.3.2 | |
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 | ||
|
Copper≧ | % | 99.8 | IPC 4562 4.6.3.1 | ||||||
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 | IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 | IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 | IPC 4562 4.6.7 | |
| High temperature oxidation resistance(200℃, 40min) | No color change | Standard | |||||||
| Solderability | Good | Standard | |||||||
| Solderability | Good | IPC 4562 4.6.12 | |||||||
3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp
Package detail:wooden box